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Magazine Name : Transactions Of The Asme, Journal Of Heat Transfer

Year : 2005 Volume number : 127 Issue: 01

Next Generation Devices For Electronic Cooling With Heat Rejection To Air (Article)
Subject: Component Thermal Resistance , Thermosyphon System
Author: R. L. Webb     
page:      02 - 10
Thermal Design Of An Airbone Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls (Article)
Subject: Airborne Pod , Pod Thermal Management Concept
Author: D. C Price      B. Elliott Short     
page:      11 - 17
A Multi-Grid Based Multi-Scale Thermal Analysis Approach For Combined Mixed Convection, Conduction And Radiation Due To Discrete Heating (Article)
Subject: Radiation , Thermal Analysis
Author: Lan Tang      Yogendra K. Joshi     
page:      18 - 26
Coupled Field Analyses In Mems With Finite Analysis (Article)
Subject: Element Analysis , Mems
Author: Ravi Chandra Sikakollu      Lemmy Meekisho      Andres Larosa     
page:      234 - 37
A Dos-Enhanced Numerical Simulation Of Heat Transfer And Fluid Flow Through An Array Of Offset Fin With Congugate Heating In The Bounding Solid (Article)
Subject: Heat Transfer , Numerical Simulation
Author: Ephraim Sparrow      John Abraham     
page:      27 - 33
A Comparative Study Of Cooling Of High Power Density Electronics Using Sprays And Microjets (Article)
Subject: Cooling , Microjets
Author: Matteo Fabbri      Shanjuan Jiang     
page:      38 - 48
Integrated Microchannel Cooling For Three-Dimensional Electronic Circuit Architecture (Article)
Subject: Electronic Circuits , Three-Dimensional
Author: Jae-Mo Koo      Sungjun Im     
page:      49 - 58
Heat Transfer In Water-Cooled Silicon Carbide Milli-Channel Heat Sinks For High Power Electronic Applications (Article)
Subject: Milli-Channel , Liquid Cooling
Author: Chris Bower      A Ortega      P. Skandakumaran     
page:      59 - 65
Microelectromechanical System-Based Evaporative Thermal Management Of High Heat Flux Electronics (Article)
Subject: Microelectromechanical. , Heat Flux Electronics
Author: Cristina. H Amon      S.-C Yao     
page:      66 - 75
An Assessment Of Module Cooling Enhancement With Thermoelectric Coolers (Article)
Subject: Thermoelectric Cooling
Author: R.E. Simsons      M.J. Ellsworth     
page:      76 - 84
Effect Of The Location And The Properties Of Thermostatic Expansion Valve Sensor Bulb On The Stability Of A Refrigeration System (Article)
Subject: Refrigeration Systems , Valve Sensor
Author: V. G Mulay      Amit Kulkarni     
page:      85 - 94
Impact Of Area Contact Between Sensor Bulb And Evaporator Return Line On Modular Refrigeration Unit: Computational And Experimental (Article)
Subject: Sensor Bulb , Refrigeration And Refrigerating
Author: Saket Karajgikar      Nikhil Lakhkar     
page:      95 - 100