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Your search returned 12 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Transactions Of The Asme, Journal Of Heat Transfer
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Year : 2005 Volume number : 127 Issue: 01 |
Next Generation Devices For Electronic Cooling With Heat Rejection To Air
(Article)
Subject:
Component Thermal Resistance
,
Thermosyphon System
Author:
R. L.
Webb
page:
02
-
10
Thermal Design Of An Airbone Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls
(Article)
Subject:
Airborne Pod
,
Pod Thermal Management Concept
Author:
D. C
Price
B.
Elliott Short
page:
11
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17
A Multi-Grid Based Multi-Scale Thermal Analysis Approach For Combined Mixed Convection, Conduction And Radiation Due To Discrete Heating
(Article)
Subject:
Radiation
,
Thermal Analysis
Author:
Lan
Tang
Yogendra K.
Joshi
page:
18
-
26
Coupled Field Analyses In Mems With Finite Analysis
(Article)
Subject:
Element Analysis
,
Mems
Author:
Ravi Chandra
Sikakollu
Lemmy
Meekisho
Andres
Larosa
page:
234
-
37
A Dos-Enhanced Numerical Simulation Of Heat Transfer And Fluid Flow Through An Array Of Offset Fin With Congugate Heating In The Bounding Solid
(Article)
Subject:
Heat Transfer
,
Numerical Simulation
Author:
Ephraim
Sparrow
John
Abraham
page:
27
-
33
A Comparative Study Of Cooling Of High Power Density Electronics Using Sprays And Microjets
(Article)
Subject:
Cooling
,
Microjets
Author:
Matteo
Fabbri
Shanjuan
Jiang
page:
38
-
48
Integrated Microchannel Cooling For Three-Dimensional Electronic Circuit Architecture
(Article)
Subject:
Electronic Circuits
,
Three-Dimensional
Author:
Jae-Mo
Koo
Sungjun
Im
page:
49
-
58
Heat Transfer In Water-Cooled Silicon Carbide Milli-Channel Heat Sinks For High Power Electronic Applications
(Article)
Subject:
Milli-Channel
,
Liquid Cooling
Author:
Chris
Bower
A
Ortega
P.
Skandakumaran
page:
59
-
65
Microelectromechanical System-Based Evaporative Thermal Management Of High Heat Flux Electronics
(Article)
Subject:
Microelectromechanical.
,
Heat Flux Electronics
Author:
Cristina. H
Amon
S.-C
Yao
page:
66
-
75
An Assessment Of Module Cooling Enhancement With Thermoelectric Coolers
(Article)
Subject:
Thermoelectric Cooling
Author:
R.E.
Simsons
M.J.
Ellsworth
page:
76
-
84
Effect Of The Location And The Properties Of Thermostatic Expansion Valve Sensor Bulb On The Stability Of A Refrigeration System
(Article)
Subject:
Refrigeration Systems
,
Valve Sensor
Author:
V. G
Mulay
Amit
Kulkarni
page:
85
-
94
Impact Of Area Contact Between Sensor Bulb And Evaporator Return Line On Modular Refrigeration Unit: Computational And Experimental
(Article)
Subject:
Sensor Bulb
,
Refrigeration And Refrigerating
Author:
Saket
Karajgikar
Nikhil
Lakhkar
page:
95
-
100
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